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FirePro 2270
amd
discrete
Released 2011-01-31
FirePro 2270
Architecture:
TeraScale 2
• Generation: FirePro Multi-View(2200)
Configure in Manual PC Builder
VRAM Capacity
0.5 GB
GDDR3
FP32 Compute
0.096 TFLOPS
Single Precision
Thermal TDP
15 W
Max Sustained Power
Memory Bandwidth
9.6 GB/s
64-bit Bus
Silicon & Compute Pipeline
Microarchitecture
TeraScale 2
Generation Series
FirePro Multi-View(2200)
Process Node
40 nm
Die Size
59 mm²
Transistor Count
0.292 Billion
Shading Units / CUDA Cores
80
Clock Speeds & Bus Interface
Base Clock Speed
600 MHz
Boost Clock Speed
600 MHz
Memory Clock
600 MHz
Memory Bus Width
64-bit
Bus Interface
PCIe 2.0 x16
Supported APIs
DirectX 11.0
Data Source:
open-gpu-db
(upstream: dbgpu). Licensed under ODbL Open Data.
Verify Upstream Record