HomeGPU DirectoryFirePro A300
amdintegratedReleased 2012-06-06

FirePro A300

Architecture: TeraScale 3 • Generation: TeraScale 3 IGP(Trinity Mobile)

Configure in Manual PC Builder
VRAM Capacity
System RAM
System Shared
FP32 Compute
0.695 TFLOPS
Single Precision
Thermal TDP
65 W
Max Sustained Power
Memory Bandwidth
Integrated
System Bus

Silicon & Compute Pipeline

MicroarchitectureTeraScale 3
Generation SeriesTeraScale 3 IGP(Trinity Mobile)
Process Node32 nm
Die Size246 mm²
Transistor Count1.303 Billion
Shading Units / CUDA Cores384

Clock Speeds & Bus Interface

Base Clock Speed760 MHz
Boost Clock Speed905 MHz
Memory ClockN/A
Memory Bus WidthN/A
Bus InterfacePCIe 2.0 x16
Supported APIsDirectX 11.0
Data Source: open-gpu-db (upstream: dbgpu). Licensed under ODbL Open Data.
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