HomeGPU DirectoryFirePro M3900
amddiscreteReleased 2010-10-19

FirePro M3900

Architecture: TeraScale 2 • Generation: FirePro Mobile(Mx900)

Configure in Manual PC Builder
VRAM Capacity
1 GB
GDDR3
FP32 Compute
0.24 TFLOPS
Single Precision
Thermal TDP
20 W
Max Sustained Power
Memory Bandwidth
14.4 GB/s
64-bit Bus

Silicon & Compute Pipeline

MicroarchitectureTeraScale 2
Generation SeriesFirePro Mobile(Mx900)
Process Node40 nm
Die Size67 mm²
Transistor Count0.37 Billion
Shading Units / CUDA Cores160

Clock Speeds & Bus Interface

Base Clock Speed750 MHz
Boost Clock Speed750 MHz
Memory Clock900 MHz
Memory Bus Width64-bit
Bus InterfacePCIe 2.0 x16
Supported APIsDirectX 11.0
Data Source: open-gpu-db (upstream: dbgpu). Licensed under ODbL Open Data.
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