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FirePro V3900
amd
discrete
Released 2012-02-07
FirePro V3900
Architecture:
TeraScale 2
• Generation: FirePro Terascale(Vx900)
Configure in Manual PC Builder
VRAM Capacity
1 GB
GDDR3
FP32 Compute
0.624 TFLOPS
Single Precision
Thermal TDP
50 W
Max Sustained Power
Memory Bandwidth
28.8 GB/s
128-bit Bus
Silicon & Compute Pipeline
Microarchitecture
TeraScale 2
Generation Series
FirePro Terascale(Vx900)
Process Node
40 nm
Die Size
118 mm²
Transistor Count
0.716 Billion
Shading Units / CUDA Cores
480
Clock Speeds & Bus Interface
Base Clock Speed
650 MHz
Boost Clock Speed
650 MHz
Memory Clock
900 MHz
Memory Bus Width
128-bit
Bus Interface
PCIe 2.0 x16
Supported APIs
DirectX 11.0
Data Source:
open-gpu-db
(upstream: dbgpu). Licensed under ODbL Open Data.
Verify Upstream Record